发明名称 PLATING APPARATUS
摘要 Disclosed is a fine globular plating apparatus which smoothly performs plating on a small part. The apparatus of the present invention comprises: a main frame (10) with an internal accommodating space; a surface processing means (20) to consecutively rotate in a first plating section, a washing section, and a second plating section along a circular line formed inside the main frame (10); an anode (30) formed on a top end unit of the main frame (10) to rise and fall in the first plating section and the second plating section to be inserted into the surface processing means (20); and a washing nozzle (40) formed on a top end unit of the main frame (10) to rise and fall in the first plating section and the second plating section, and to be inserted into the surface processing means (20). The apparatus of the present invention is able to automatically perform different types of plating and washing with one input.
申请公布号 KR20160045367(A) 申请公布日期 2016.04.27
申请号 KR20140140785 申请日期 2014.10.17
申请人 DUKSAN HIGH METAL CO., LTD. 发明人 KWAK, JUNG UG;CHUN, MYOUNG HO;KIM, KYEONG WON
分类号 C25D17/16;C25D17/18;C25D21/08 主分类号 C25D17/16
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