| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a die bonder which prevents electrostatic destruction caused by electrostatically charging a collet and a die (a work-piece) and also prevents misplacement due to static electricity when the die (the work-piece) is placed on an object (a substrate, a tray and the like). <P>SOLUTION: The die bonder of the present invention includes: a bonding head having a collet which is grounded and holds and releases a die; an electrometer measuring electric potential of the collet; and ground determination means determining whether or not the collet is grounded on the basis of the result of the electrometer. <P>COPYRIGHT: (C)2013,JPO&INPIT |
