COOLING OF ELECTRONIC AND/OR ELECTRICAL COMPONENTS BY PULSED HEAT PIPE AND HEAT CONDUCTION ELEMENT

摘要

Cooling of electronic and/or electrical components by pulsed heat pipe and heat conduction element A cooling system (10) for a device comprising electronic and/or electrical components (10) to be cooled comprises an oscillating heat pipe (11) having a tube in which a heat transfer fluid flows in a pulsed manner. The tube is wound so as to form a coil (12). The system (10) comprises at least one heat conduction element (13) in contact with the components (100) and in contact with a primary surface (12a) of the coil (12). The heat conduction element (13) is in contact on part of said primary surface (12a) such that the oscillating heat tube (11) has at least one hot part for evaporation of the heat transfer fluid situated at the contact zone between the coil (12) and the heat conduction element (13) and serving to discharge heat from the components (100) and at least one cold part for condensation of the heat transfer fluid situated outside the contact zone between the coil (12) and the heat conduction element (13) and serving to dissipate the heat absorbed by the oscillating heat pipe (11).