| 摘要 |
An equipment front end module (EFEM) useful for transferring wafers to and from wafer processing modules comprises an enclosure which is bounded by a front wall, a rear wall, a first and a second side wall, a top wall, and a bottom wall, and has a controlled environment therein. The first side wall and the second side wall comprise two or more wafer load ports. The wafer load ports each is adapted to accommodate a FOUP. The front wall comprises wafer ports attached to load locks operable to allow a wafer to be transferred to a front wall cluster processing tool. The back wall comprises a wafer port to be in an operational relationship with a rear wall cluster processing tool. A robot in the EFEM enclosure can operate to transfer wafers through the wafer load ports, a first front wall wafer port, a second front wall wafer port, and a rear wall wafer port. |
