| 摘要 |
A method is disclosed for manufacturing a sealed cavity comprised in a microelectronic device, comprising forming a sacrificial layer at least at locations where the cavity is to be provided, depositing a membrane layer on top of the sacrificial layer, patterning the membrane layer in at least two separate membrane layer blocks, removing the sacrificial laye through the membrane layer, and sealing the cavity by sealing the membrane layer, wherein patterning the membrane layer is performed after removal of the sacrificial layer; and associated microelectronic devices. |
