METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD

摘要

On a printed wiring board obtained by a method of manufacturing a printed board, a predetermined component (90) is to be mounted on at least one of a front surface side and a back surface side. The manufacturing method includes the steps of preparing a CFRP core (10), forming a through hole (1) so as to penetrate the CFRP core (10) from the front surface side to the back surface side and include a region in which the component (90) is to be mounted when viewed in a plan view, and embedding a GFRP core (30) having insulating properties within the through hole (1) by filling the through hole (1) with a resin (24) having insulating properties and curing the resin (24). According to the manufacturing method, the component (90) mounted on the printed board is not affected by a stray capacitance due to a CFRP, and it is not difficult to form a circuit.