| 摘要 |
The present invention relates to a power module which can be easily manufactured and miniaturized and a manufacturing method thereof. According to the present invention, the power module comprises: a substrate in which an insulation layer is formed on a circuit layer; and at least one electronic device and at least one external connection terminal mounted in the substrate by a flip-chip method. An active surface having a plurality of electrodes formed thereon is boned to the insulation layer in the electronic device. |
