| 摘要 |
Provided is a photosensitive resin composition which exhibits excellent photosensitivity, flexibility, adhesiveness, pencil hardness, solvent resistance, acid resistance, heat resistance, and plating resistance. Also provided is a cured product comprising the same. To this end, the photosensitive resin composition contains (A) an alkali aqueous solution-soluble resin, (B) a cross-linking agent, (C) a photopolymerization initiator, and (D) an epoxy resin represented by chemical formula 1. In the chemical formula 1, the value of (i)/(ii) is 1-3, and G represents a glycidyl group, whereas n is an average value of a repetition number ranging from 0 to 5. |
