| 摘要 |
[Problem] The purpose of the present invention is to provide an MEMS sensor having improved uniformity of stress that operates to a bonding interface of a metal bonding section. [Solution] A frame body (14) that partitions an operation region (15) and an external region (16) from each other is formed in a functional layer (10). The frame body and a supporting substrate (1) are bonded to each other with a first insulating layer (3a) therebetween. The frame body and a wiring board (2) are bonded to each other with a metal bonding section (30a) therebetween. In the metal bonding section, a first metal layer (31a) is formed on the surface of the wiring board, a second metal layer (32a) is formed on the surface of the frame body, and the first metal layer and the second metal layer are bonded to each other by being heated and pressurized. The outer circumferential side surface (3c) of the first insulating layer is retracted further toward the operation region than the outer circumferential side surface (14a) of the frame body. An outer circumferential end portion (B) of a bonding interface (A) between the first metal layer and the second metal layer is positioned further toward outside in the direction to be away from the operation region than the outer circumferential side surface of the first insulating layer. |
