发明名称 ラミネート装置
摘要 PROBLEM TO BE SOLVED: To make it so that no excess liquid remains on a base material of a printed circuit board when a dry film is laminated on, while a surface of the base material is sufficiently wet before the dry film is laminated on.SOLUTION: A laminating device includes: film conveyance means 20 for conveying a dry film D, so as to pass through a predetermined position K2 on a main surface of a base material B of a printed circuit board that is to be conveyed in a predetermined conveyance direction T; a liquid substance coating apparatus 30 for applying a liquid substance M on the main surface of base material B, which is provided further upstream than the predetermined position K2; and a crimping device 40 that is being pressed against while being heated with the dry film D on the main surface of base material B that has been applied with the liquid substance M at the predetermined position K2. Positions (K1, h1) that have been applied with the liquid substance M on the main surface of the base material B by the liquid substance coating apparatus 30 are lower than predetermined positions (K2, h0) where the dry film D is pressed against the base material B by the crimping device 40.
申请公布号 JP5913050(B2) 申请公布日期 2016.04.27
申请号 JP20120244144 申请日期 2012.11.06
申请人 株式会社フジクラ 发明人 小島 章徳
分类号 H05K3/06;B29C63/02 主分类号 H05K3/06
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