发明名称 硬化性オルガノポリシロキサン組成物及び半導体装置
摘要 PROBLEM TO BE SOLVED: To provide a curable organopolysiloxane composition which forms a cured material having a high refractive index, high light transmittance, and good adhesion to a substrate, and to provide a semiconductor device having excellent reliability.SOLUTION: Provided is a curable organopolysiloxane composition comprising: (A) an organopolysiloxane represented by an average composition formula having alkenyl groups and aryl groups; (B) an organopolysiloxane having at least two hydrogen atoms bound to silicon atoms in one molecule, and in which 15 mole% or more of total organic groups bound to silicon atoms is aryl groups; (C) a branched organopolysiloxane represented by an average composition formula having alkenyl groups, aryl groups, and epoxy-containing organic groups; and (D) a catalyst for a hydrosilylation reaction, and to provide a semiconductor device made by coating a semiconductor element by a cured material of the composition.
申请公布号 JP5913538(B2) 申请公布日期 2016.04.27
申请号 JP20140235351 申请日期 2014.11.20
申请人 東レ・ダウコーニング株式会社 发明人 佐川 貴志;寺田 匡慶;吉武 誠
分类号 C08L83/07;C08L83/05;C08L83/06;H01L23/29;H01L23/31;H01L33/56 主分类号 C08L83/07
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