发明名称 METHOD FOR LASER PUNCHING THROUGH-HOLE IN NON-METAL PLATE
摘要 FIELD: optics; physics.SUBSTANCE: invention relates to laser punching of through hole in non-metal plate and can be used in producing plates from semiconductor, ceramic and glass-like materials with holes. Plate surface is exposed to pulsed laser radiation. Pulsed radiation wavelength is selected from condition: 1.2<h<3.1, whereis plate material absorption at wavelength of laser radiation; h is thickness of plate. Initial laser beam is divided into two beams and coaxially to act on both surfaces of plate with energy density defined by relationship:where e is base of natural logarithm; Q is specific energy of sublimation material; R is coefficient of reflection of material. Surface of plate pre-polished.EFFECT: reduced power consumption in laser punching of through holes in plates of non-metallic materials having volumetric absorption of laser radiation.2 cl, 2 dwg
申请公布号 RU2582849(C1) 申请公布日期 2016.04.27
申请号 RU20140146914 申请日期 2014.11.24
申请人 FEDERALNOE GOSUDARSTVENNOE UNITARNOE PREDPRIJATIE"VSEROSSIJSKIJ NAUCHNO-ISSLEDOVATELSKIJ INSTITUT AVTOMATIKI IM. N.L. DUKHOVA" (FGUP "VNIIA") 发明人 KOVALENKO ALEKSANDR FEDOROVICH
分类号 B23K26/364 主分类号 B23K26/364
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