发明名称 |
METHOD FOR LASER PUNCHING THROUGH-HOLE IN NON-METAL PLATE |
摘要 |
FIELD: optics; physics.SUBSTANCE: invention relates to laser punching of through hole in non-metal plate and can be used in producing plates from semiconductor, ceramic and glass-like materials with holes. Plate surface is exposed to pulsed laser radiation. Pulsed radiation wavelength is selected from condition: 1.2<h<3.1, whereis plate material absorption at wavelength of laser radiation; h is thickness of plate. Initial laser beam is divided into two beams and coaxially to act on both surfaces of plate with energy density defined by relationship:where e is base of natural logarithm; Q is specific energy of sublimation material; R is coefficient of reflection of material. Surface of plate pre-polished.EFFECT: reduced power consumption in laser punching of through holes in plates of non-metallic materials having volumetric absorption of laser radiation.2 cl, 2 dwg |
申请公布号 |
RU2582849(C1) |
申请公布日期 |
2016.04.27 |
申请号 |
RU20140146914 |
申请日期 |
2014.11.24 |
申请人 |
FEDERALNOE GOSUDARSTVENNOE UNITARNOE PREDPRIJATIE"VSEROSSIJSKIJ NAUCHNO-ISSLEDOVATELSKIJ INSTITUT AVTOMATIKI IM. N.L. DUKHOVA" (FGUP "VNIIA") |
发明人 |
KOVALENKO ALEKSANDR FEDOROVICH |
分类号 |
B23K26/364 |
主分类号 |
B23K26/364 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|