发明名称 |
JOINING MATERIAL AND JOINING METHOD USING SAME |
摘要 |
A bonding material of a silver paste includes: fine silver particles having an average primary particle diameter of 1 to 50 nanometers, each of the fine silver particles being coated with an organic compound having a carbon number of not greater than 8, such as hexanoic acid; silver particles having an average primary particle diameter of 0.5 to 4 micrometers, each of the silver particles being coated with an organic compound, such as oleic acid; a solvent containing 3 to 7 % by weight of an alcohol and 0.3 to 1% by weight of a triol; a dispersant containing 0.5 to 2 % by weight of an acid dispersant and 0.01 to 0.1 % by weight of phosphate ester dispersant; and 0.01 to 0.1% by weight of a sintering aid, such as diglycolic acid, wherein the content of the fine silver particles is in the range of from 5% by weight to 30% by weight, and the content of the silver particles is in the range of from 60 % by weight to 90% by weight, the content of the total of the fine silver particles and the silver particles being not less than 90 % by weight. |
申请公布号 |
EP3012048(A1) |
申请公布日期 |
2016.04.27 |
申请号 |
EP20140814197 |
申请日期 |
2014.06.19 |
申请人 |
DOWA ELECTRONICS MATERIALS CO., LTD. |
发明人 |
ENDOH, KEIICHI;NAGAOKA, MINAMI;KURITA, SATORU;MIYOSHI, HIROMASA;KOHNO, YOSHIKO;MIYAZAWA, AKIHIRO |
分类号 |
B22F1/00;B22F1/02;B22F7/08;H05K3/32 |
主分类号 |
B22F1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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