发明名称 SOLDERING DEVICE AND METHOD, AND MANUFACTURED SUBSTRATE AND ELECTRONIC COMPONENT
摘要 Provided are a soldering device and a soldering method which allow for soldering at low cost with high yield and high reliability. The soldering device has: first organic fatty acid-containing solution bath 21 in which workpiece member 10 having a copper electrode is immersed in organic fatty acid-containing solution 31a; space section 24 having a steam atmosphere of organic fatty acid-containing solution 31b, the space section horizontally having ejection unit 33 to spray a jet stream of a molten solder to the copper electrode provided on workpiece member 10 and ejection unit 34 to spray a liquid to an excess of the molten solder for removal; and second organic fatty acid-containing solution bath 23 in which workpiece member 10 from which the excess of the molten solder is removed in space section 24 is immersed again in organic fatty acid-containing solution 31 c.
申请公布号 EP2671661(A4) 申请公布日期 2016.04.27
申请号 EP20120829099 申请日期 2012.04.14
申请人 TANIGUROGUMI CORPORATION 发明人 TANIGURO, KATSUMORI
分类号 B23K1/018;B23K1/08;B23K1/20;B23K35/26;H05K3/34 主分类号 B23K1/018
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