发明名称 ポジ型感光性樹脂組成物、硬化膜、保護膜、絶縁膜、半導体装置、および表示体装置
摘要 PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition which can achieve high resolution and high sensitivity at the i-line as well as excellent resistance to a strong alkaline aqueous solution.SOLUTION: A positive photosensitive resin composition contains an alkali-soluble resin (A), a photosensitive agent (B), and a thermal base generator (C). The alkali-soluble resin (A) is preferably a polyamide resin, and more preferably a polyamide resin with a structure represented by the general formula (1). (In the formula, X and Y are each an organic group. Rrepresents a hydroxyl group, a carboxyl group, -O-Ror -COO-R. When there are more than one, they can be identical or different. Rrepresents a hydrogen atom or a C1-C15 organic group. In addition, l is an integer from 0 to 8, and a represents the polymerization degree and is an integer from 2 to 500.)
申请公布号 JP5910109(B2) 申请公布日期 2016.04.27
申请号 JP20120013739 申请日期 2012.01.26
申请人 住友ベークライト株式会社 发明人 池田 拓司;樫野 智將
分类号 G03F7/023;C08G69/26;G03F7/004 主分类号 G03F7/023
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