| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent a chamfered outer peripheral edge from being chipped when grinding a wafer of a bonded wafer. <P>SOLUTION: An outer peripheral edge 13 of a surface 10a of a wafer 10 is removed to a depth not reaching a back surface 10b, and a residual portion 14 is left on the side of the back surface 10b (outer peripheral removal step). Then, a bonded wafer 1 is formed by sticking the surface 10a of the wafer 10 onto a support wafer 20 (bonded wafer formation step), then the residual portion 14 is removed with a cutting blade 37 (residual portion removal step), and thereafter, the back surface 10b of the wafer is ground or polished and thinned to a prescribed thickness (thinning step). By performing thinning in the state without a chamfered outer peripheral edge 14, chipping of the outer peripheral edge 14 is prevented. <P>COPYRIGHT: (C)2013,JPO&INPIT |
