| 摘要 |
The purpose is to provide the following: an epoxy resin composition capable of maintaining flame retardancy without containing a halogenated flame retardant in the epoxy resin composition, being heat-resistant for lead-free soldering, and with which it is possible to obtain a substrate that maintains excellent plating adhesion; a prepreg obtained from the composition; and a metal-clad laminate and a printed wiring board on which a resin insulating layer is formed from the composition. An epoxy resin composition containing a phosphorus-modified phenolic curing agent and an epoxy compound, the epoxy resin composition being characterized in that the phosphorus-modified phenolic curing agent contains a phosphorus compound and a compound represented by formula (I) (In the formula, R represents a hydroxyl group or a O-methyl group, and n represents an integer of 2 or greater), and by the phosphorus compound being bonded to the aliphatic carbon in the compound represented by formula (I). |
