发明名称 |
HIGH CURRENT, LOW EQUIVALENT SERIES RESISTANCE PRINTED CIRCUIT BOARD COIL FOR POWER TRANSFER APPLICATION |
摘要 |
A method for fabricating an electric coil on a circuit board comprising fabricating on the circuit board a first coil layer comprising a coil trace and a plurality of vias distributed along the length of the coil trace, and overlaying a second coil layer on the first coil layer, wherein the vias of the first coil layer join the first coil layer and the second coil layer. |
申请公布号 |
EP2823494(B1) |
申请公布日期 |
2016.04.27 |
申请号 |
EP20130706889 |
申请日期 |
2013.02.18 |
申请人 |
HUAWEI TECHNOLOGIES CO., LTD. |
发明人 |
ZABACO, JORGE |
分类号 |
H01F27/28;H01F17/00;H01F41/04;H02J5/00 |
主分类号 |
H01F27/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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