发明名称 部品実装方法及び部品実装システム
摘要 In the present invention, on the basis of a relative positional relationship with respect to an electrode corresponding to solder on a substrate, a target fitting position of a component, and a correction value for the target fitting position, the orientation of positional displacement with respect to the electrode corresponding to the solder and the orientation of the correction of the target fitting position according to the correction value are simultaneously displayed on a display device. It is determined, for a component in which a fitting defect has occurred after component fitting, whether the cause of the fitting defect is in the process for detecting the position of the solder, the process for calculating the correction value, or the process for fitting the component.
申请公布号 JP5909649(B2) 申请公布日期 2016.04.27
申请号 JP20120202568 申请日期 2012.09.14
申请人 パナソニックIPマネジメント株式会社 发明人 中村 光男;伊藤 克彦;永井 大介
分类号 H05K13/08;H05K13/04 主分类号 H05K13/08
代理机构 代理人
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