| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor inspection jig capable of correctly measuring device characteristics.SOLUTION: An electrically conductive jig block 1 has a hole 2 having an opening on an upper surface thereof. An electrically conductive heat radiation block 6 is vertically moved inside the hole 2 of the jig block 1. Springs 9 push up the heat radiation block 6 with respect to the jig block 1 and allow a part of the heat radiation block 6 to be projected from the upper surface of the jig block 1. A collet 10 imposes a load from above on a semiconductor device 12 placed on the upper surface of the jig block 1 and pressurizes a rear surface electrode 16 of the semiconductor device 12 against the heat radiation block 6. An electrically conductive member 21 comes in contact with the heat radiation block 6 without interrupting the vertical movement of the heat radiation block 6 and electrically connects the jig block 1 to the heat radiation block 6. An electric route from the rear surface electrode 16 of the semiconductor device 12 to the jig block 1 via the heat radiation block 6 and the electrically conductive member 21 is shorter than an electric route from the rear surface electrode 16 of the semiconductor device 12 to the jig block 1 via the heat radiation block 6 and the springs 9. |
