发明名称 |
HEAT-DISSIPATING STRUCTURE FOR LIGHTING APPARATUS AND LIGHTING APPARATUS |
摘要 |
There is provided a lighting device including: a light emitting module having at least one light emitting device outputting light and a light emitting device board on which the at least one light emitting device is disposed; a housing installed on one side of a ring in a central axis direction relatively to the light emitting device board; and a resin globe installed to cover the light emitting module, wherein the globe has a plurality of protrusions formed by retaining at least a portion of a gate unit used in molding the globe, and the light emitting device board may have notch portions combined with the protrusions. |
申请公布号 |
EP2792944(A4) |
申请公布日期 |
2016.04.27 |
申请号 |
EP20120858384 |
申请日期 |
2012.12.14 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
TAKENAKA, HIROMITSU;MORISHITA, ICHIRO |
分类号 |
F21V29/00;F21V17/00 |
主分类号 |
F21V29/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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