| 摘要 |
Provided is a light emitting device package. The light emitting device package according to an embodiment includes: a substrate; a light emitting structure disposed under the substrate and including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; first and second electrodes connected to the first and second conductive semiconductor layers; a first pad connected to the first electrodes in first-first through-holes, which are one part of the first through-holes, to expose the first conductive semiconductor layer by penetrating the second conductive semiconductor layer and the active layer; a first insulation layer disposed between the first pad and the second conductive semiconductor layer and between the first pad and the active layer to cover the first electrodes in first-second through-holes which are the other part of the first through-holes; and a second pad connected to the second electrode through a second through-hole penetrating the first insulation layer disposed under the second conductive semiconductor layer and electrically spaced apart from the first pad. The second pad does not overlap the first insulation layer in the first-second through-holes in the thickness direction of the light emitting structure. |
