| 发明名称 | Electro-optical transceiver device to enable chip-to-chip interconnection | ||
| 摘要 | An apparatus includes a substrate and a waveguide coupled to a surface of the substrate. The surface forms a cladding layer of the waveguide. The apparatus includes a photodetector optically coupled to an end of the waveguide. The photodetector is configured to output an electrical signal responsive to receiving a light signal from a core of the waveguide. The apparatus also includes an amplifier device coupled to the substrate. The amplifier device is electrically coupled to the photodetector to amplify the electrical signal to produce an amplified electrical signal. | ||
| 申请公布号 | US9325420(B2) | 申请公布日期 | 2016.04.26 |
| 申请号 | US201414280270 | 申请日期 | 2014.05.16 |
| 申请人 | QUALCOMM Incorporated | 发明人 | Lai Kwan-yu;Shenoy Ravindra Vaman;Kim Jitae;Lasiter Jon Bradley;Kidwell, Jr. Donald William;Gousev Evgeni Petrovich |
| 分类号 | H04B10/00;H04B10/50;G02B6/43;G02B6/42;H03F3/08;G01J1/04;G02B6/00 | 主分类号 | H04B10/00 |
| 代理机构 | Toler Law Group, PC | 代理人 | Toler Law Group, PC |
| 主权项 | 1. An apparatus comprising: a substrate; a waveguide coupled to a surface of the substrate, wherein the surface forms a cladding layer of the waveguide; and a photodetector configured to optically couple to an end of the waveguide, the photodetector configured to output an electrical signal responsive to receiving a light signal from a core of the waveguide. | ||
| 地址 | San Diego CA US | ||