发明名称 Semiconductor device and method for manufacturing the same
摘要 A semiconductor device includes a first oxide semiconductor film over an insulating surface; a second oxide semiconductor film over the first oxide semiconductor film; a source electrode and a drain electrode in contact with side surfaces of the first oxide semiconductor film, side surfaces of the second oxide semiconductor film, and the top surface of the second oxide semiconductor film; a third oxide semiconductor film over the second oxide semiconductor film, the source electrode, and the drain electrode; a gate insulating film over the third oxide semiconductor film; and a gate electrode in contact with the top surface of the gate insulating film. A length obtained by subtracting a channel length between the source electrode and the drain electrode from a length of the second oxide semiconductor film in the channel length direction is 0.2 times to 2.0 times as long as the channel length.
申请公布号 US9324876(B2) 申请公布日期 2016.04.26
申请号 US201414474533 申请日期 2014.09.02
申请人 Semiconductor Energy Laboratory Co., Ltd. 发明人 Kobayashi Yoshiyuki;Matsubayashi Daisuke
分类号 H01L31/06;H01L29/786;H01L29/417 主分类号 H01L31/06
代理机构 Robinson Intellectual Property Law Office 代理人 Robinson Intellectual Property Law Office ;Robinson Eric J.
主权项 1. A semiconductor device comprising: a first oxide semiconductor film over an insulating surface; a second oxide semiconductor film over the first oxide semiconductor film; a source electrode and a drain electrode in contact with a side surface of the first oxide semiconductor film, a side surface of the second oxide semiconductor film, and a top surface of the second oxide semiconductor film; a third oxide semiconductor film over the second oxide semiconductor film, the source electrode, and the drain electrode; a gate insulating film over the third oxide semiconductor film; and a gate electrode in contact with a top surface of the gate insulating film and facing the top surface and the side surface of the second oxide semiconductor film, wherein the second oxide semiconductor film has a first length in a channel length direction, wherein the source electrode and the drain electrode have a second length between the source electrode and the drain electrode, and wherein a third length obtained by subtracting the second length from the first length is 0.2 times to 2.0 times as long as the second length.
地址 Kanagawa-ken JP