Interposers with circuit modules encapsulated by moldable material in a cavity, and methods of fabrication

摘要

Stacked dies (110) are encapsulated in an interposer's cavity (304) by multiple encapsulant layers (524) formed of moldable material. Conductive paths (520, 623) connect the dies to the cavity's bottom all (304B) and, through TSVs passing through the bottom wall, to a conductor below the interposer. The conductive paths can be formed in segments each of which is formed in a through-hole (514) in a respective encapsulant layer. Each segment can be formed by electroplating onto a lower segment; the electroplating current can be provided from below the interposer through the TSVs and earlier formed segments. Other features are also provided.

主权项

1. A circuit assembly comprising a plurality of levels “Li” where Li varies from L0 through Ln, i being an integer varying from 0 to n, wherein n is an integer greater than one, the circuit assembly comprising a substrate whose top side comprises a cavity comprising a bottom wall;
wherein the level L0 comprises: the bottom wall; a plurality of through-holes each of which passes through the bottom wall; a plurality of conductors (“L0 conductors”) in respective through-holes; wherein at least part of level L1 overlies at least part of level L0, and wherein level L1 comprises one or more circuit modules each of which has one or more contact pads each of which is electrically connected to one or more L0 conductors; wherein for each level Li other than L0 and L1: at least part of level Li overlies at least part of level Li-1; each level Li comprises one or more circuit modules each of which has one or more contact pads each of which is electrically connected to one or more L0 conductors by one or more first electrically conductive paths lying in the cavity, each first electrically conductive path passing through each level L1 through Li-1; wherein at least one first electrically conductive path passes through more than one of the levels L1 through Ln-1.