Multilayer ceramic electronic component to be embedded in board and printed circuit board having multilayer ceramic electronic component embedded therein

摘要

There is provided a multilayer ceramic electronic component to be embedded in a board including: a ceramic body including dielectric layers and having first and second main surfaces opposing one another, first and second lateral surfaces opposing one another, and first and second end surfaces opposing one another; first and second internal electrodes stacked to be spaced apart from both end surfaces of the ceramic body at a predetermined distance with the dielectric layers interposed therebetween, respectively; and first and second external electrodes formed in both end portions of the ceramic body, wherein the first and second external electrodes include first and second base electrodes and first and second terminal electrodes formed on the first and second base electrodes, respectively, and a non-conductive paste layer is formed on both lateral surfaces of the ceramic body.

主权项

1. A multilayer ceramic electronic component to be embedded in a board, the multilayer ceramic electronic component comprising:
a ceramic body including dielectric layers and having first and second main surfaces opposing one another, first and second lateral surfaces opposing one another, and first and second end surfaces opposing one another; first internal electrodes and second internal electrodes stacked to be spaced apart from both end surfaces of the ceramic body at a predetermined distance with the dielectric layers interposed therebetween and having first and second leads exposed to the first and second lateral surfaces of the ceramic body, respectively; and first and second external electrodes formed in both end portions of the ceramic body, wherein the first and second external electrodes comprise first and second base electrodes electrically connected to the first and second internal electrodes, respectively, and first and second terminal electrodes formed on the first and second base electrodes, respectively, and a non-conductive paste layer is formed on both lateral surfaces of the ceramic body in which the first and second base electrodes are formed.