Electronic component and method of manufacturing the same

摘要

An external terminal of an electronic component is provided with a lead base material and a metal thin film coating a surface of the lead base material, and an average value of a crystal size index is not less than 7, which is defined based on dimensions of a crystal particle in a direction perpendicular to the lead base material surface and in a direction parallel thereto, taken on a cut surface of the metal thin film defined by a given plane cutting the metal thin film in a direction perpendicular to the lead base material surface. Such constitution provides an electronic component having an external terminal coated with a metal thin film of a simple structure constituted of Sn or a Sn-based and substantially Pb-free alloy, formed by plating on a surface of a lead base material.

主权项

1. An electronic component comprising an external terminal including a lead base material constituted of a predetermined metal material, and a metal thin film coating a surface of said lead base material and including at least a first layer constituted of a material substantially Pb-free and predominantly composed of tin,
wherein an average value of a crystal size index is not less than 7 when said crystal size index is defined as (a+b)/2, where a and b respectively represent dimensions in μm of a crystal particle constituting said first layer in a direction perpendicular to said lead base material surface and in a direction parallel thereto, taken on a cut surface of said first layer defined by a given plane cutting said first layer in a direction perpendicular to said lead base material surface.