发明名称 多孔質コアを含む機械的摩擦デバイス
摘要 This invention concerns a mechanical friction device (10), in particular a brake or clutch disc. The friction device (10) includes a central layer (16) which is sandwiched between two outer, friction layers (18.1, 18.2). The central layer (16) has a porosity level higher than that of the two friction layers (18.1, 18.2). The central layer (16) is in the form of a wire-frame structure (30, 40) which acts as heat transfer means to transfer heat away from the friction surfaces of the outer, friction layers (18.1, 18.2). In the preferred embodiment the wire-frame structure is either an X-type lattice sandwich structure (30) or a wire-woven bulk diamond structure (40). This invention also concerns the use of wire-frame structure as a heat transfer means in a mechanical friction device (10) such as a brake or clutch disc.
申请公布号 JP5908661(B2) 申请公布日期 2016.04.26
申请号 JP20150540264 申请日期 2013.11.05
申请人 ユニヴァーシティ・オブ・ザ・ウィットウォーターズランド・ヨハネスブルグ 发明人 トングベウム・キム;フランク・ヴェルナー・キーンホーファー
分类号 F16D65/12;F16D13/62 主分类号 F16D65/12
代理机构 代理人
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