Hybrid integrated optical device with passively aligned laser chips having submicrometer alignment accuracy

摘要

A hybrid optical device includes an optical bench chip, a laser chip with a laser waveguide flip-chip bonded onto the optical bench chip, and an optical waveguide chip with an optical device waveguide disposed adjacent the optical bench chip. The optical bench chip has multiple “U” shaped alignment optical waveguides and the optical waveguide chip has multiple alignment optical waveguides, and the pitches of the various sets of alignment waveguides are different. A misalignment between the laser waveguide and the optical bench chip is compensated for by aligning the optical waveguide chip to different positions of the optical bench chip using the multiple alignment optical waveguides on the optical bench chip and the optical waveguide chip, without turning on the laser, so that the laser waveguide of the laser chip is aligned with the optical device waveguide of the optical device chip.

主权项

1. A hybrid integrated optical device comprising:
at least one optical bench chip having a first side and a second side opposite to the first side and a set of U shaped alignment optical waveguides formed at the first side of the optical bench chip, wherein each of the set of U shaped alignment optical waveguides has a first end and a second end exposed on one end face of the optical bench chip; at least one laser chip having a first side and a second side opposite to the first side and at least one laser waveguide formed at the first side of the laser chip; wherein the laser chip is approximately aligned and flip-chip bonded onto the optical bench chip with the first side of the laser chip facing the first side of the optical bench chip; an optical waveguide chip disposed adjacent the optical bench chip, the optical waveguide chip having a first side and a second side opposite to the first side and at least one optical device waveguide and a first set and a second set of alignment optical waveguides formed at the first side of the optical waveguide chip, wherein each of the alignment optical waveguides has an end exposed on one end face of the optical waveguide chip which faces the one end face of the optical bench chip, wherein the laser waveguide of the laser chip is aligned with the optical device waveguide of the optical waveguide chip, and wherein the end of at least one of the first set of alignment optical waveguides of the optical waveguide chip is aligned with the first end of one of the U shaped alignment optical waveguides of the optical bench chip, the end of at least one of the second set of alignment optical waveguides of the optical waveguide chip is aligned with the second end of the one of the U shaped alignment optical waveguides of the optical bench chip, and the end of at least another one of the first set of alignment optical waveguides of the optical waveguide chip is misaligned with the first end of another one of the U shaped alignment optical waveguides of the optical bench chip, and the end of at least another one of the second set of alignment optical waveguides of the optical waveguide chip is misaligned with the second end of the other one of the U shaped alignment optical waveguides of the optical bench chip.