Semiconductor device manufacturing method and semiconductor mounting substrate

摘要

A semiconductor device manufacturing method includes: a first-process for placing, on a first-substrate on which traces and first-electrodes are formed, each of the first-electrodes being connected to one of traces, a second-substrate in which through-holes corresponding to the first-electrodes and relay-members are disposed, each of the relay-members being formed of solder, penetrating through one of the through-holes, and projecting from both ends of the one of the through-holes, so that the first-electrodes are aligned with the through-holes in a plan view; a second-process for melting the relay-members so that the relay-members are connected to the first-electrodes, after the first-process; and a third-process for placing a semiconductor substrate on which a second-electrodes corresponding to the first-electrodes are formed on a side opposite to the first-substrate across the second-substrate, after the second-process, to connect the first-electrodes and the second-electrodes to each other via the relay-members.

主权项

1. A semiconductor mounting substrate comprising:
a first substrate on which a plurality of traces and a plurality of first electrodes are formed, each of the plurality of first electrodes being connected to one of the plurality of first traces; and a second substrate in which a plurality of through holes corresponding to the plurality of first electrodes and a plurality of relay members are disposed, each of the plurality of relay members being formed of solder, penetrating through one of the plurality of through holes, projecting from both ends of the one of the plurality of through hole, and having one end connected to one of the plurality of first electrode, wherein the plurality of relay members have upper surfaces on a single plane opposite to the first substrate across the second substrate.