发明名称 Power semiconductor device to reduce voltage variation between terminals
摘要 The purpose of the present invention is to reduce variance of a voltage to be applied between the terminals of each of the power semiconductor elements, and to improve lifetime of the power semiconductor elements and reliability of the power semiconductor device. In order to achieve the purpose, in this power semiconductor device, which is provided with three or more power semiconductor elements that are aligned and mounted on a metal wire, and another metal wire different from the metal wire, one terminal of each of the power semiconductor elements being connected to the wire and another one terminal thereof being connected to the other wire, the resistance value of the metal wire in a region where the power semiconductor elements are mounted is higher in the downstream side than that in the upstream side in the electric current flowing direction.
申请公布号 US9325257(B2) 申请公布日期 2016.04.26
申请号 US201314402492 申请日期 2013.04.09
申请人 Panasonic Intellectual Property Management Co., Ltd. 发明人 Okayama Yoshio
分类号 H02M7/537;H01L25/07;H02M7/00;H01L23/495;H01L23/48;H01L23/498;H01L23/50;H01L25/18;H01L23/31;H01L23/00;H02M1/088 主分类号 H02M7/537
代理机构 RatnerPrestia 代理人 RatnerPrestia
主权项 1. A power semiconductor device comprising: a first metal wire which is connected to a first external connection terminal; a second metal wire which is connected to a second external connection terminal; a third metal wire which is connected to a third external connection terminal; a first power semiconductor element group which includes three or more first power semiconductor elements that are mounted on the first metal wire; and a second power semiconductor element group which includes second power semiconductor elements of the same number as the first power semiconductor elements, the second power semiconductor elements being mounted on the second metal wire, wherein an electrode which the first power semiconductor element is provided with is connected to the second metal wire by a first conductive member, and an electrode which the second power semiconductor element is provided with is connected to the third metal wire by a second conductive member, and with respect to a resistance value of a region on which the first power semiconductor element group or the second power semiconductor element group is mounted, the resistance value of a downstream side is larger than that of an upstream side in an electric current flowing direction, the region being included in the first metal wire or the second metal wire, or with respect to a resistance value of a region to which the first conductive member or the second conductive member is connected, the resistance value of a downstream side is smaller than that of an upstream side in the electric current flowing direction, the region being included in the second metal wire or the third metal wire.
地址 Osaka JP