Chemically amplified positive-type photosensitive resin composition and method for producing resist pattern using the same

摘要

A chemically amplified positive-type photosensitive resin composition including a compound represented by the following formula (1), having a melting point of 40° C. or lower at 1 atm, a resin whose solubility in alkali increases under the action of an acid, and a photoacid generator. In the formula, R1 represents a hydrogen atom or an organic group; and R2, R3, and R4 independently represent a monovalent hydrocarbon group which may have a substituent, and at least two of R2, R3, and R4 may be bonded to each other to form a cyclic structure.;

主权项

1. A chemically amplified positive-type photosensitive resin composition, comprising:
a compound represented by the following formula (1), having a melting point of 40° C. or lower at 1 atm; a resin whose solubility in alkali increases under the action of an acid; and a photoacid generator, wherein in the formula (1), R1 a hydrogen atom or an unsubstituted alkyl, cycloalkyl, alkenyl, cycloalkenyl, aryl or aralkyl group R2, and R3 independently represent a monovalent hydrocarbon group which may have a substituent except a halogen atom; R4 independently represents a monovalent hydrocarbon group selected from the group consisting of a cycloalkenyl group and an aralkyl group, each of which may have a substituent.