| 摘要 |
To provide: an active ester resin which has excellent heat resistance and moisture absorption resistance, and provides a cured product having low dielectric constant and low dielectric loss tangent; an epoxy resin composition which contains this active ester resin as a curing agent; a cured product of this epoxy resin composition; a prepreg; a circuit board; and a buildup film. An active ester resin which is characterized by having a molecular structure represented by structural formula (1). |
