发明名称 レーザー加工装置
摘要 A laser processing apparatus includes a beam diameter adjusting unit provided between a laser oscillator and a focusing unit, an imaging unit for detecting the beam diameter of the laser beam directed to a detection path, an optical path length changing unit for moving the imaging unit along the detection path to thereby change an optical path length, and a controller for controlling the imaging unit, the beam diameter adjusting unit, and the optical path length changing unit. The controller operates to move the imaging unit to two positions where different optical path lengths are provided, detect the beam diameters of the laser beam at the two positions, and controls the beam diameter adjusting unit according to the two beam diameters detected above so that the two beam diameters have a predetermined relation.
申请公布号 JP5908705(B2) 申请公布日期 2016.04.26
申请号 JP20110261578 申请日期 2011.11.30
申请人 株式会社ディスコ 发明人 森數 洋司
分类号 B23K26/00;H01S3/00 主分类号 B23K26/00
代理机构 代理人
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