Semiconductor device

摘要

A cooling fin 9 is joined to a semiconductor element 1. A resin 10 encapsulates the semiconductor element 1. A portion of the cooling fin 9 projects from a lower surface of the resin 10. A cooler 11 has an opening 12. The cooling fin 9 projecting from the resin 10 is inserted in the opening 12 of the cooler 11. The lower surface of the resin 10 and the cooler 11 are joined to each other by a joining material 13 such as an adhesive. Therefore, a reduction in the number of component parts and a reduction in weight can be achieved, and compatibility between the heat conductivity and the strength of joining can be ensured.

主权项

1. A semiconductor device comprising:
a semiconductor element; a cooling fin joined to the semiconductor element and including a projecting portion having a plurality of recesses; a resin encapsulating the semiconductor element and having a main surface; and a cooler having a wall and an opening passing entirely through the wall, wherein the projecting portion of the cooling fin projects from the main surface of the resin, the projecting portion of the cooling fin is inserted in the cooler via the opening, further comprising an adhesive, wherein the adhesive directly contacts both the main surface of the resin and the cooler, the cooler contains a cooling medium that is supplied to the cooling fin, and the projecting portion of the cooling fin makes direct contact with the cooling medium inside the cooler.