Electronic assembly for mounting on electronic board

摘要

An embodiment of an electronic assembly for mounting on an electronic board includes a plurality of electric contact regions exposed on a mounting surface of the electronic board. The electronic assembly includes a chip of semiconductor material in which at least one electronic component is integrated, at least one support element including a first main surface and a second main surface opposite to the first main surface, the chip being enclosed by the at least one support element, a heat dissipation plate thermally coupled to said chip to dissipate the heat produced by it, exposed on the first main surface of the support element, a plurality of contact elements, each electrically coupled to a respective electric terminal of the electronic component integrated in the chip, exposed on the same first main surface of which is exposed to the dissipation plate. Also included are a plurality of electric connection elements, each adapted to electrically intercouple a respective contact element of the electronic assembly with a corresponding electric contact region of the electronic board, in such a way that the second main surface of the at least one support element faces the mounting surface of the electronic board.

主权项

1. An integrated-circuit assembly, comprising:
a package including a first side, a second side opposite to the first side, and a third side disposed between the first and second sides, a conductive contact element disposed along the first side, and a heat dissipater disposed along the first side; an integrated-circuit chip disposed in the package, the integrated-circuit chip being thermally coupled to the heat dissipater, and the integrated-circuit chip having a conductive contact pad electrically coupled to the contact element; a conductor having a first end electrically coupled to the contact element, extending along the third side of the package, and having a second end that is accessible from the second side of the package; a support element having an opening; wherein the package is disposed in the opening; and wherein the conductor is disposed in the support element.