发明名称 Pattern formation method, stamper manufacturing method, and magnetic recording medium manufacturing method
摘要 According to one embodiment, a pattern formation method includes steps of forming a layer to be processed on a substrate, forming a metal microparticle layer by coating the layer to be processed with a metal microparticle coating solution containing metal microparticles and a solvent, reducing a protective group amount around the metal microparticles by first etching, forming a protective layer by exposing the substrate to a gas containing C and F and adsorbing the gas around the metal microparticles to obtain a projection pattern, and transferring the projection pattern to the layer to be processed by second etching.
申请公布号 US9324355(B2) 申请公布日期 2016.04.26
申请号 US201414206271 申请日期 2014.03.12
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 Takizawa Kazutaka;Iwasaki Takeshi;Takeo Akihiko
分类号 B44C1/22;C03C15/00;C03C25/68;C23F1/00;G11B5/84;C25D1/10;H01L21/3065;H01L21/263;H01L21/311;G03F1/00;G03F7/00;G11B5/855 主分类号 B44C1/22
代理机构 Oblon, McClelland, Maier & Neustadt, L.L.P. 代理人 Oblon, McClelland, Maier & Neustadt, L.L.P.
主权项 1. A pattern formation method, comprising: forming a layer to be processed on a substrate; forming a metal microparticle layer by coating the layer to be processed with a metal microparticle coating solution comprising metal microparticles and a solvent; reducing a protective group amount around the metal microparticles by first etching; after the reducing the protective group, exposing the substrate and the metal microparticles to a gas comprising carbon and fluorine to form a protective layer, to adsorb the gas around the metal microparticles to substitute the gas for the protective group, and to obtain a projection pattern; and transferring the projection pattern to the layer to be processed by second etching.
地址 Minato-ku JP