Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

摘要

Packaged microelectronic devices and methods of manufacturing packaged microelectronic devices are disclosed herein. In one embodiment, a method of manufacturing a microelectronic device includes forming a stand-off layer over a plurality of microelectronic dies on a semiconductor workpiece, and removing selected portions of the stand-off layer to form a plurality of stand-offs with the individual stand-offs positioned on a backside of a corresponding die. The method further includes cutting the semiconductor workpiece to singulate the dies, and attaching the stand-off on a first singulated die to a second die.

主权项

1. A system, comprising a microelectronic device including:
a support member; one or more microelectronic dies including a first microelectronic die, the first microelectronic die including a backside attached to the support member, an active side opposite the backside, a plurality of terminals at the active side, and an integrated circuit operably coupled to the terminals; one or more stand-offs positioned on the one or more dies in a one-to-one correspondence, the one or more stand-offs including a stand-off attached to the active side of the first die; and a second microelectronic die including a backside, an active side opposite the backside, a plurality of terminals at the active side, and an integrated circuit operably coupled to the terminals, wherein the backside of the second die is attached to the stand-off without an adhesive between the stand-off and the backside of the second die.