Microphone, acoustic sensor, and method of manufacturing acoustic sensor

摘要

A microphone has a package, and an acoustic sensor, an under surface of which is fixed to an inner face of the package. The acoustic sensor has a substrate having a plurality of hollows penetrating the substrate from a top surface to an under surface, and a capacitor structure made by a movable electrode plate and a fixed electrode plate disposed above each of the hollows. A package sound hole is opened in the package in a position opposed to the under surface of the acoustic sensor. A dent which is communicated with each of the hollows and open below the under surface side of the substrate is formed below the under surface of the substrate. A height of the dent measured from the under surface of the substrate is equal to or less than half of a height of the hollow.

主权项

1. A microphone comprising:
a package; and an acoustic sensor, an under surface of which is fixed to an inner face of the package, wherein the acoustic sensor comprises:
a substrate having a plurality of hollows penetrating the substrate from a top surface to an under surface, anda capacitor structure made by a movable electrode plate and a fixed electrode plate disposed above each of the hollows, wherein a package sound hole is opened in the package in a position opposed to the under surface of the acoustic sensor, wherein a dent which is communicated with each of the hollows and open below the under surface side of the substrate is formed below the under surface of the substrate, and wherein a height of the dent measured from the under surface of the substrate is equal to or less than half of a height of the hollow.