The present invention relates to a soldering flux which can be used in a spray type by improving viscosity of the soldering flux. The soldering flux comprises: 8-9 parts by weight of water; 10-40 parts by weight of a solvent; and 21-51 parts by weight of an active agent. According to the present invention, provided is the soldering flux which improves spraying ability of a spray nozzle, and minimizes damage to a PCB.
