CURABLE RESIN COMPOSITION FOR INKJET PRINTING, SOLDER RESIST USING THE SAME AND METHOD FOR MANUFACTURING THE SAME

摘要

The present invention relates to a curable resin composition for an inkjet printer, a solder resist using the same, and a producing method thereof. The curable resin composition for an inkjet printer comprises: a cyclic compound which has 4 to 20 carbon atoms, and includes at least two ethylene-based unsaturated groups; an aromatic compound which has 1 to 10 carbon atoms, and includes at least three ethylene-based unsaturated groups; and a photoinitiator. In the curable resin composition for an inkjet printer, the weight ratio of the cyclic compound which has 4 to 20 carbon atoms, and includes at least two ethylene-based unsaturated groups and the aromatic compound which has 1 to 10 carbon atoms, and includes at least three ethylene-based unsaturated groups is 2:1 to 10:1. In addition, the curable resin composition for an inkjet printer can show excellent thermal resistance, chemical resistance and mechanical properties.