发明名称 半導体装置の検査回路、検査方法及び検査装置
摘要 According to one embodiment, a stack includes first and second wiring structures and an inspection circuit. The inspection circuit includes a switching circuit having an input terminal, a drive terminal, and an output terminal electrically connected with a discharge mechanism. The inspection circuit is configured such that, in a state where a first electric connection is made in the first wiring structure and a second electric connection is made in the second wiring structure, at the time of applying charges to first and second electrodes, the charge applied to the second electrode flows to the drive terminal through the second wiring structure to bring the input terminal and the output terminal of the switching circuit into an electrically conducted state, and the charge applied to the first electrode flows to the discharge mechanism through the first wiring structure and the switching circuit.
申请公布号 JP5908418(B2) 申请公布日期 2016.04.26
申请号 JP20130016958 申请日期 2013.01.31
申请人 株式会社東芝 发明人 遠 藤 光 芳
分类号 H01L21/66;G01R31/302 主分类号 H01L21/66
代理机构 代理人
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