| 发明名称 | Three-dimensional semiconductor image reconstruction apparatus and method | ||
| 摘要 | A system comprises an electron beam directed toward a three-dimensional object with one tilting angle and at least two azimuth angles, a detector configured to receive a plurality of scanning electron microscope (SEM) images from the three-dimensional object and a processor configured to calculate a height and a sidewall edge of the three-dimensional object. | ||
| 申请公布号 | US9324178(B2) | 申请公布日期 | 2016.04.26 |
| 申请号 | US201414536313 | 申请日期 | 2014.11.07 |
| 申请人 | Taiwan Semiconductor Manufacturing Company, Ltd. | 发明人 | Cheng Wen-Hao;Tu Chih-Chiang;Fu Chung-Min;Nandoriya Ajay |
| 分类号 | H01J37/28;G06T15/10;G01N23/203;H01J37/26 | 主分类号 | H01J37/28 |
| 代理机构 | Slater & Matsil, L.L.P. | 代理人 | Slater & Matsil, L.L.P. |
| 主权项 | 1. A system comprising: an electron beam directed toward a three-dimensional object with one tilting angle and at least two azimuth angles, wherein the at least two azimuth angles are applied to the three-dimensional object subsequently, and the three-dimensional object is not part of the system; a detector configured to receive a plurality of scanning electron microscope (SEM) images from the three-dimensional object; and a processor configured to calculate a height and a sidewall edge of the three-dimensional object based upon the SEM images. | ||
| 地址 | Hsin-Chu TW | ||