发明名称 Laminating device and apparatus having the same
摘要 A laminating device for laminating at least one flexible substrate includes a frame, a pressing module, a driving module, a pressure sensor and a control module. The pressing module is disposed on the frame. The pressing module at least includes a first roller and a second roller which are used for moving relative to each other. The driving module is connected to the first roller for driving the first roller. The pressure sensor is disposed on one side of the second roller and opposite to the first roller for detecting a pressure of the pressing module. The control module is electronically connected to the pressure sensor and the driving module for ordering the driving module to adjust the position of the first roller based on the difference between the pressure detected by the pressure sensor and a predetermined pressure.
申请公布号 US9321252(B2) 申请公布日期 2016.04.26
申请号 US201314031609 申请日期 2013.09.19
申请人 INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE 发明人 Li Chang-Chou;Liu Chin-Lung;Ke Chih-Yu
分类号 B32B37/00;B32B41/00 主分类号 B32B37/00
代理机构 Muncy, Geissler, Olds & Lowe, P.C. 代理人 Muncy, Geissler, Olds & Lowe, P.C.
主权项 1. A laminating device for laminating at least one flexible substrate, the laminating device comprising: a frame; a pressing module disposed on the frame, wherein the pressing module at least comprises a first roller and a second roller which are configured for moving relative to each other; a driving module connected to the first roller for driving the first roller; a pressure sensor disposed on one side of the second roller and opposite to the first roller for detecting a pressure of the pressing module; an insulator sleeved around the pressure sensor, so that the pressure sensor is covered in the insulator; and a control module electronically connected to the pressure sensor and the driving module for ordering the driving module to adjust the position of the first roller based on the difference between the pressure detected by the pressure sensor and a predetermined pressure.
地址 Hsinchu TW