SEMICONDUCTOR PACKAGE TEST BLADE AND SEMICONDUCTOR PACKAGE TEST APPARATUS COMPRISING THE SAME

摘要

The present invention relates to a semiconductor package test blade and a semiconductor package test apparatus preventing damage to a semiconductor package that might occur during a semiconductor package defect determination. The semiconductor package test blade according to the present invention includes: a blade body formed in a lower end portion of a pressurizing device for testing a semiconductor package and provided with a first surface in contact with the semiconductor package and a groove recessed to have a level higher than a lower surface level of the first surface in a direction opposite to the first surface; a vacuum adsorption picker penetrating a central portion of the blade body and vacuum-adsorbing and gripping the semiconductor package; and a flexible silicon layer formed in contact with a second surface which is a bottom surface of the groove, and a level of the lowermost surface of the flexible silicon layer is substantially same as a level of the lowermost surface of the first surface.