CHIP ELECTRONIC COMPONENT AND BOARD HAVING THE SAME MOUNTED THEREON

摘要

The present invention relates to a chip electronic component and a board for mounting a chip electronic component. The chip electronic component includes: an insulating substrate; a first inner coil unit disposed on one surface of the insulating substrate; a second inner coil unit disposed on the other surface facing the one surface of the insulating substrate; a via penetrating the insulating substrate to connect the first and second inner coil units; and a first via pad disposed on the one surface of the insulating substrate to cover the via and a second via pad disposed on the other surface of the insulating substrate. When a width of a coil pattern of the first and second inner coil units is a, and a maximum width of the first and second via pads is b, b/a satisfies 1<=b/a<2.3.