发明名称 |
CMOS integrated method for fabrication of thermopile pixel on semiconductor substrate with buried insulation regions |
摘要 |
A method for manufacturing an imaging device in a semiconductor substrate is disclosed. The substrate includes a first surface, a second surface substantially opposite the first surface, and a thickness defined by a distance between the first surface and the second surface. A trench is fabricated in the semiconductor substrate first surface. A passivation layer is applied over the substrate first surface and the trench, optionally filling the trench by depositing a conformal layer over the substrate first surface. The conformal layer and the passivation layer are planarized from the substrate first surface, and a membrane is fabricated on the substrate first surface. From the substrate second surface, a cavity is formed in the substrate abutting the membrane and at least a portion of the trench via the unmasked region. |
申请公布号 |
US9324760(B2) |
申请公布日期 |
2016.04.26 |
申请号 |
US201414159762 |
申请日期 |
2014.01.21 |
申请人 |
Excelitas Technologies Singapore Pte. Ltd |
发明人 |
Vasseur Philippe;Huminic Grigore D.;Karagoezoglu Hermann;Marinescu Radu M. |
分类号 |
H01L27/146;G01J5/02;G01J5/12;H01L21/76;H01L31/0236 |
主分类号 |
H01L27/146 |
代理机构 |
Sheehan Phinney Bass & Green PA |
代理人 |
Nieves Peter A.;Sheehan Phinney Bass & Green PA |
主权项 |
1. A method for manufacturing an imaging device in a semiconductor wafer comprising a substrate with a first surface, a second surface substantially opposite the first surface, and a thickness defined by a distance between the first surface and the second surface, comprising the steps of:
fabricating a trench in the first surface; applying a passivation layer over the first surface and the trench; planarizing the passivation layer to remove a portion of the passivation layer from the first surface; fabricating a membrane upon the first surface; applying a first mask to the second surface, wherein an unmasked region of the second surface corresponds to a membrane central reion and wherein the first mask defines a cavity profile shape; and from the second surface, forming a cavity in the substrate abutting the membrane and at least a portion of the trench via the unmasked region of the second surface, wherein forming the cavity in the substrate further comprises etching the cavity having a shape substantially according to the cavity profile shape, and extending a portion of the cavity substantially adjacent to the membrane to abut at least a portion of the trench. |
地址 |
Singapore SG |