发明名称 Semiconductor device and method for manufacturing semiconductor device
摘要 A semiconductor device is provided with a semiconductor element having a plurality of electrodes, a plurality of terminals electrically connected to the plurality of electrodes, and a sealing resin covering the semiconductor element. The sealing resin covers the plurality of terminals such that a bottom surface of the semiconductor element in a thickness direction is exposed. A first terminal, which is one of the plurality of terminals, is disposed in a position that overlaps a first electrode, which is one of the plurality of electrodes, when viewed in the thickness direction. The semiconductor device is provided with a conductive connection member that contacts both the first terminal and the first electrode.
申请公布号 US9324677(B2) 申请公布日期 2016.04.26
申请号 US201214009993 申请日期 2012.04.02
申请人 ROHM CO., LTD. 发明人 Kimura Akihiro;Sunaga Takeshi
分类号 H01L23/48;H01L23/00;H01L21/56;H01L23/495;H01L25/065;H01L23/31 主分类号 H01L23/48
代理机构 Howison & Arnott, LLP 代理人 Howison & Arnott, LLP
主权项 1. A method for manufacturing a semiconductor device, the method comprising the steps of: forming a plurality of terminals on a base; placing a semiconductor element so as to overlap the plurality of terminals when viewed in a thickness direction of the base; sealing the plurality of terminals and the semiconductor element with a resin; and removing the base, wherein the semiconductor element has a plurality of electrodes, the step of placing the semiconductor element includes the step of forming a conductive connection member that contacts a first electrode, which first electrode comprises one of the plurality of electrodes, and a first terminal, which first terminal comprises one of the plurality of terminals, and the conductive connection member including: a columnar member that contacts both the first electrode and the first terminal, anda fixing member that surrounds the columnar member and spreads on a surface of the first terminal,wherein the method further comprises the steps of: placing the fixing member on the first terminal; andcausing the columnar member to move through the fixing member until contacting with the first terminal, wherein the fixing member is melted for this step, thereby causing the melted fixing member to move up along a side face of the columnar member.
地址 Kyoto-Shi, Kyoto JP
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