| 发明名称 | Modified via bottom for beol via efuse | ||
| 摘要 | An electronic fuse structure including an Mx level including a first Mx metal, a second Mx metal, and an Mx cap dielectric above of the first and second Mx metal, an Mx+1 level above the Mx level, the Mx+1 level including an Mx+1 metal and a via electrically connecting the Mx metal to the Mx+1 metal in a vertical orientation, and a nano-pillar located within the via and above the second Mx metal. | ||
| 申请公布号 | US9324655(B2) | 申请公布日期 | 2016.04.26 |
| 申请号 | US201414520390 | 申请日期 | 2014.10.22 |
| 申请人 | GLOBALFOUNDRIES INC. | 发明人 | Bao Junjing;Bonilla Griselda;Choi Samuel S.;Filippi Ronald G.;Lustig Naftali E.;Simon Andrew H. |
| 分类号 | H01L23/52;H01L21/76;H01L29/00;H01L23/525;H01L23/522;H01L21/768 | 主分类号 | H01L23/52 |
| 代理机构 | Roberts Mlotkowski Safran & Cole, P.C. | 代理人 | Ivers Catherine;Calderon Andrew M.;Roberts Mlotkowski Safran & Cole, P.C. |
| 主权项 | 1. An electronic fuse structure, the structure comprising: an Mx level comprising a first Mx metal, a second Mx metal, and an Mx cap dielectric above of the first and second Mx metal; an Mx+1 level above the Mx level, the Mx+1 level comprising an Mx+1 metal and a via electrically connecting the second Mx metal to the Mx+1 metal in a vertical orientation; and a nano-pillar comprising etched portions of the Mx cap dielectric located within the via and above the second Mx metal. | ||
| 地址 | Grand Cayman KY | ||