发明名称 Thermal processing and consolidation system and method
摘要 A method for thermally processing and curing unprocessed components within a thermal processing and consolidation system which includes upper and lower chamber assemblies configured to couple to one another and a first tool, the method including positioning the first tool on the lower chamber assembly moving the lower chamber assembly relative to the upper chamber assembly and coupling the upper chamber assembly and the lower chamber assembly to form a plenum, thereby completely enclosing the first tool in the plenum, the plenum operable to maintain a pressurized and/or temperature controlled environment about the first tool, providing services to the first tool and the plenum via a service interface, and thermally processing and curing the first set of unprocessed components within the first tool wherein the services are supplied to the first tool as directed by a set of process parameters.
申请公布号 US9321217(B2) 申请公布日期 2016.04.26
申请号 US201414158510 申请日期 2014.01.17
申请人 Lightweight Labs, LLC. 发明人 Jacobsen Ronald M.;Pelc Antonin;Bamford, Jr. Calvin D.;Cooke Terrance William;Croston Victor Wayne;Warrick Russell Carver
分类号 B29C70/00;B29C70/44;B29C35/02;B32B1/00;B32B5/26;B32B5/28;B32B37/06;B32B37/10;B32B37/14;B65B5/04;B29C31/00 主分类号 B29C70/00
代理机构 Hauptman Ham, LLP 代理人 Hauptman Ham, LLP
主权项 1. A method for thermally processing and curing unprocessed components within a thermal processing and consolidation system which comprises upper and lower assemblies configured to couple to one another and a first tool, at least one of the upper assembly or the lower assembly being a chamber assembly, said method comprising: laying up, bagging and sealing a first set of unprocessed components in the first tool; positioning the first tool on the lower assembly, wherein the first tool contacts and supports the first set of unprocessed components at least after the tool is positioned on the lower assembly; moving at least one of the lower assembly relative to the upper assembly or the upper assembly relative to the lower assembly and coupling the upper assembly and the lower assembly to form a plenum, thereby completely enclosing the first tool in the plenum, the plenum operable to maintain a pressurized and/or temperature controlled environment about the first tool; providing services to the first tool and the plenum via a service interface; and thermally processing and curing the first set of unprocessed components within the first tool wherein the services are supplied to the first tool as directed by a set of process parameters.
地址 Tacoma WA US